JPS629665Y2 - - Google Patents
Info
- Publication number
- JPS629665Y2 JPS629665Y2 JP1980055549U JP5554980U JPS629665Y2 JP S629665 Y2 JPS629665 Y2 JP S629665Y2 JP 1980055549 U JP1980055549 U JP 1980055549U JP 5554980 U JP5554980 U JP 5554980U JP S629665 Y2 JPS629665 Y2 JP S629665Y2
- Authority
- JP
- Japan
- Prior art keywords
- noise filter
- filter element
- connector
- electrodes
- connector pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 26
- 238000005476 soldering Methods 0.000 claims description 15
- 239000011810 insulating material Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- 239000003990 capacitor Substances 0.000 description 5
- 238000005336 cracking Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 230000004907 flux Effects 0.000 description 3
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000010405 reoxidation reaction Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980055549U JPS629665Y2 (en]) | 1980-04-23 | 1980-04-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980055549U JPS629665Y2 (en]) | 1980-04-23 | 1980-04-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56156288U JPS56156288U (en]) | 1981-11-21 |
JPS629665Y2 true JPS629665Y2 (en]) | 1987-03-06 |
Family
ID=29650201
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1980055549U Expired JPS629665Y2 (en]) | 1980-04-23 | 1980-04-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS629665Y2 (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6126281U (ja) * | 1984-07-24 | 1986-02-17 | ティーディーケイ株式会社 | コネクタ |
-
1980
- 1980-04-23 JP JP1980055549U patent/JPS629665Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS56156288U (en]) | 1981-11-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6805277B1 (en) | Process for soldering electric connector onto circuit board | |
JP4203950B2 (ja) | コモンモードフィルタ及びその製造方法 | |
US20080023214A1 (en) | Flexible printed circuit cable and method of soldering the same to a printed circuit board | |
TW451370B (en) | Semiconductor device and manufacturing method thereof | |
US6372998B1 (en) | Electrical component connecting structure of wiring board | |
US5281152A (en) | Surface-mounted electronic component | |
JP4431756B2 (ja) | 樹脂封止型半導体装置 | |
JPS629665Y2 (en]) | ||
US7439625B2 (en) | Circuit board | |
JP3287810B2 (ja) | 電気コネクタ | |
JPH07263050A (ja) | 超音波溶接用テープ電線及びその接合構造 | |
JPH06283836A (ja) | プリント基板の接続構造および接続方法 | |
JPS6023911Y2 (ja) | コネクタ | |
JP2020088183A (ja) | 配線基板及び電子装置 | |
KR100850457B1 (ko) | 양면의 단자가 연결된 기판 및 이를 제조하는 방법 | |
US4696105A (en) | Mounting method for electrical components having connections both on and off a circuit board | |
JP3237909B2 (ja) | 可撓性基板の端子構造 | |
JPH06334292A (ja) | 可撓性基板の端子構造 | |
JP3296104B2 (ja) | コネクタピン接続装置及びその組立方法 | |
CN2459769Y (zh) | 电连接器 | |
JPH04298092A (ja) | 回路基板およびその製造方法 | |
JPS6023910Y2 (ja) | コネクタ | |
JP2728230B2 (ja) | リードの接合法 | |
JP2978779B2 (ja) | 垂直型表面実装コネクタ | |
JPH0331085Y2 (en]) |